SiP(System in Package): From the traditional Single chip with passive components, developing to Multi chip multifunctional chip with passive components, including normal chip (Die bond/Wire bond) and Flip Chip hybrid packaging technology, as well as other devices such as MEMS or optical Sensor devices and other devices are prioritized to be assembled together, to achieve a certain function of the standard package and forming a system or sub-system. Package types are LGA, BGA and so on.

IOT/Smart Home, IOT series (Bluetooth /Wifi, etc.), UAV/Intelligent Robot Control Module, Automotive Intelligent Driving Position/Autonomous Driving, Mobile Terminal 5G communication and other Applications.

1. 5G PAM/FEM/DiFEM/PAMiF/PAMiD etc
2. DS-SiP module technology
3. High precision 01005/008004 SMT Mounting Technology
4. Multi-chips mounting，GaAs FC/WLCSP/Crystal and other substrate interposer mounting
5. SiP EMI shielding technology
6. SiP module size 2×1.6 ~50~52mm